Plastic compounds combine the properties of filler (e.g. ceramic or metallic) and plastic in one material. The inheritance of the filler characteristics to the respective compound becomes more pronounced with higher filler content in the finished material.
In existing compounds, the processability, especially the flowability in injection-moulding, decreases rapidly with increasing filling content. The full performance can often not be delivered because the limits of processability have been reached.
The patented PlastFormance technology makes it possible to maintian the injection-moulding capability even at very high filler contents (80 % vol.). Depending on the filler used, it is possible to adjust the desired material properties (e.g. electrical conductivity or insulation). Since we use powdery instead of flaky filler particles, thermal conductivities of up to 20 W/mK can be achieved not only in-plane, but integrally.
Best of both worlds?