In the processes used to date for the production of thermally conductive, highly filled compounds, flaky-shaped fillers are used. With these fillers, filler contents of approx. 50% can be achieved. However, these are only suitable as alternative heat sink materials to a limited extent, as they have limited thermal conductivities. The problem is that when the injection molding melt solidifies, the flaky-shaped fillers solidify on the surface in the direction of flow, while they arrange themselves randomly in the center of the component. On the one hand, this reduces the proportion of fillers with the result that the thermal conductivity is reduced. On the other hand, the platelets arranged in the surface plane have a highly anisotropic material behavior, since the thermal conductivity in the depth direction is limited by their arrangement. Therefore, PlastFormance has developed a revolutionary, patented process to produce highly filled compounds with powder instead of flaky mixtures. This not only increases the filler content and flowability of the compounds, but also the thermal conductivities. Since the finest powder mixtures have homogeneous, isotropic properties, the thermal conductivity is also guaranteed integrally by the component in all directions in space. In addition to excellent thermal conductivities, our products also have very low electrical conductivites. This makes the novel high-performance compounds ideal for injection-mouldable heat sinks.